導熱矽膠片 - HP Series:http://www.ccec.com.tw/product_695246.html

HP系列導熱矽膠片適用於填充加熱元件和散熱片或金屬基底之間空隙。其材質柔軟性和彈性使它們適合於非常不平的表面的塗層。熱可以傳輸至從分開的元件或甚至整個PCB，這在效果增強了發熱的電子元件的效率和壽命時間的金屬外殼或散熱板。

HP Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.